Linley microprocessor report: Ceva-SensPro2 Doubles AI Throughput

Second-Generation Sensor Hubs Target Automotive, IoT, and Wearables
By Mike Demler (February 8, 2021)
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February 2021
© The Linley Group • Microprocessor Report
Ceva-SensPro2 adds more base configurations and new design options to Ceva’s sensor-fusion-DSP lineup. Like the first-generation Ceva-SensPro from 2020, the licensable intellectual property (IP) implements a configurable sensor hub, fusing elements from the company’s Ceva-BX2 DSPs, Ceva-XM6 computer-vision engine, and NeuPro deep-learning accelerators (DLAs). Compared with first generation designs manufactured in the same process technology, Ceva-SensPro2 delivers twice the AI inference throughput and twice the memory bandwidth when running fully connected neuralnetwork layers. It also provides a 20% power reduction at the same performance and up to 6x the performance on DSP algorithms. Production RTL for all models is now available for general licensing.

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