Linley microprocessor report: Ceva SensPro2 Doubles AI Throughput

Second-Generation Sensor Hubs Target Automotive, IoT, and Wearables
By Mike Demler (February 8, 2021)
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February 2021
© The Linley Group • Microprocessor Report
SensoPro2 adds more base configurations and new design options to Ceva’s sensor-fusion-DSP lineup. Like the first-generation SensPro from 2020, the licensable intellectual property (IP) implements a configurable sensor hub, fusing elements from the company’s BX2 DSPs, XM6 computer-vision engine, and NeuPro deep-learning accelerators (DLAs). Compared with first generation designs manufactured in the same process technology, SensPro2 delivers twice the AI inference throughput and twice the memory bandwidth when running fully connected neuralnetwork layers. It also provides a 20% power reduction at the same performance and up to 6x the performance on DSP algorithms. Production RTL for all models is now available for general licensing.

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