Amir Panush has served as our Chief Executive Officer since January 2023. Prior to his current position, Mr. Panush served as CEO and General Manager of InvenSense, Inc., a TDK group company. Mr. Panush previously held various leadership positions at TDK, following TDK’s successful acquisition of InvenSense in 2017. Mr Panush joined InvenSense in 2015, serving as head of the company’s Strategy & Corporate Development, where he drove strategic expansion and diversification efforts. Prior to InvenSense, Mr. Panush held several leadership roles at Qualcomm Inc. and led strategic marketing and partnerships at Atheros Communications (acquired by Qualcomm). His earlier industry roles spanned software engineering and project management leadership at Texas Instruments and Comsys Mobile (acquired by Intel). Mr. Panush holds a Master of Business Administration from Haas Business School, University of California at Berkeley and a bachelor’s degree, Cum Laude, in Computer Science from Technion Institute of Technology in Israel.
Yaniv Arieli has served as our Chief Financial Officer since May 2005. Prior to his current position, Mr. Arieli served as President of U.S. Operations and Director of Investor Relations of DSP Group beginning in August 2002 and Vice President of Finance, Chief Financial Officer and Secretary of DSP Group’s DSP Cores Licensing Division prior to that time. Before joining DSP Group in 1997, Mr. Arieli served as an account manager and certified public accountant at Kesselman & Kesselman, a member of PricewaterhouseCoopers, a leading accounting firm. Mr. Arieli is a CPA and holds a B.A. in Accounting and Economics from Haifa University in Israel and an M.B.A. from Newport University and is also a member of the National Investor Relation Institute.
Michael Boukaya has served as our Chief Operating Officer since April 2019. Prior to this position, Mr. Boukaya served as our Vice President and General Manager of the wireless business unit since 2014. Previously, Mr. Boukaya served as VP and Chief Architect with overall responsibility for the research and development of next generation DSP cores, wireless platform architectures and multimedia processors. Before joining Ceva, he was with DSP Group, Inc., holding different engineering and research and development management positions. Mr. Boukaya holds a B.Sc. in Electronic Engineering from the Technion Technology Institute, graduated from Executive Program of Stanford Graduate School of Business, and holds several patents on DSP technology.
Gweltaz Toquet has served as our Chief Commercial Officer since January 2023. Mr. Toquet has more than 20 years of sales and management experience at Ceva, most recently serving as Vice President of Sales for APAC, India and Europe. Previously, he spent over 15 years in Hong Kong as Ceva’s Vice President of Sales for Asia, leading the build-out and management of the sales and support organization in the region, spanning China, Japan, Taiwan and Korea. Before joining Ceva in 2002, Mr. Toquet held several roles in sales, business development, product marketing and business line management at Freehand DSP and Texas Instruments. Mr. Toquet holds a MSE from the Institut Supérieur d’Electronique de Paris (ISEP).
Iri Trashanski has served as our Chief Strategy Officer since August 2023. In this role he leads the company’s strategy, marketing, and corporate development functions. Mr. Trashanski is a seasoned executive with more than 20 years of experience across the semiconductor value chain. Prior to his current position, Mr. Trashanski served as VP and GM of Data Center at GlobalFoundries, where he achieved an impressive growth in annual revenues and profitability. Prior to GlobalFoundries, Mr. Trashanski held the position of Senior Vice President of Product and Market Development at Hitachi Vantara, where he steered strategic product direction, execution, and pivotal partnerships. His leadership journey includes significant executive positions at Samsung Semiconductors, Marvell, and SanDisk. He holds a Master of Business Administration degree from Babson College and a Bachelor of Arts degree from IDC, Israel.
Dana Maor-Megiddo serves as our VP People since January 2020. In this role, she leads the global human resource strategy and implementation at Ceva. Dana is a seasoned human resources executive with over 20 years of experience across industries and geographies, in companies that are fast growing, merging, and evolving. Previously, Mrs. Maor-Megiddo has served as Chief People Officer of ThetaRay, VP HR of MX1, and SVP HR at Perion, Frutarom Industries, Radvision (an Avaya Company) and Amdocs. She also spent two years as an independent human resources consultant for tech start-ups. Mrs. Maor-Megiddo holds a B.A. in Psychology and Criminology, and an M.A. in industrial and Social Psychology, both from Bar Ilan University.
Erez Bar-Niv has more than 25 years of experience in the semiconductor and silicon industries. Prior to joining Ceva, Mr. Bar-Niv served as the Vice President of R&D at the Cores BU of DSP Group. Prior to joining DSP Group in 1998, Mr. Bar-Niv held various R&D and application positions in National Semiconductor. Mr. Bar-Niv holds a B.Sc. for electrical engineering from Tel-Aviv University in Israel and holds several US patents.
Moshe Sheier serves as our Vice President of Marketing. Mr. Sheier brings with him more than 20 years of experience in the semiconductor IP and chip industry in both development and managerial roles. Prior to this position, Mr. Sheier was the Director of Product Marketing at Ceva and before that he has managed Xilinx Inc. partner program in EMEA. Before joining Ceva, he was with the DSP Group since 1993, holding different engineering and R&D management positions, including the VLSI Department Manager. Mr. Sheier holds several US patents in the area of DSP architectures, a B.Sc. in Electrical Engineering from the Tel-Aviv University and an M.B.A. from the Open University of Israel.
Ran Snir serves as our Vice President and General Manager of the Vision Business Unit since April 2021. Prior to this, Mr. Snir has served as VP Research & Development at Ceva since 2014, and before that he was Ceva’s Director of VLSI. Mr. Snir has worked with Ceva and the Licensing Division of DSP Group since 1999 in various VLSI and R&D positions. Mr. Snir holds a B.Sc. degree in Electrical Engineering from the Tel-Aviv University and a Master of Business Administration from IDC Herzliya.
Chad Lucien serves as Vice President and General Manager of Ceva’s Sensing and Audio Business Unit. Previously, Mr. Lucien was President of Hillcrest Labs, a sensor fusion software and systems company, which was acquired by Ceva from InterDigital in July 2019. He brings nearly 25 years of experience having held a range of roles that have spanned sales, marketing, business development, and corporate finance. Before joining Hillcrest Labs, he held positions in software, consulting and investment banking firms. Mr. Lucien has a degree in Finance and Marketing from the University of Virginia in the United States.
Tal Shalev serves as Vice President and General Manager of Ceva’s Wireless IoT Business Unit since August 2021. He brings more than 18 years of experience in the semiconductor industry and is highly knowledgeable in wireless communication technologies. Mr. Shalev joined Ceva in 2015, and served as Product Director of Wireless IPs. Prior to Ceva, he worked in Marvell Cellular BU in several engineering and managerial roles, and also as R&D manager in optiQGain. Mr. Shalev has a B.Sc. degree in Electrical Engineering from the Tel-Aviv University, and holds several US patents in the areas of Wireless Communication and Digital Signal Processing.
Guy Keshet serves as our Vice President and General Manager of the Mobile Broadband Business Unit Since June 2021. Prior to this, Mr. Keshet was Ceva’s Director of Wireless Platform Solution since March 2016. He brings more than 20 years of experience in the wireless communication industry in both development and managerial roles spanning from Software, Algorithms, System and VLSI. Mr. Keshet holds a B.Sc. and a M.Sc. degrees in Electrical Engineering, both form the Technion Technology Institute.