CEVA Brings a High Performance, Low-Power Audio Platform to Consumer Devices

SAN JOSE, Calif. - June 27, 2005 - CEVA, Inc. (NASDAQ: CEVA;
LSE: CVA) the leading licensor of digital signal processor (DSP) cores,
multimedia, GPS and storage platforms to the semiconductor industry, today
unveiled CEVA-Audio™ - a new DSP-based audio platform targeting
high-volume markets such as portable audio players, cellular handsets and
home entertainment equipment. CEVA-Audio is a low-power, low-cost platform
that combines several CEVA-developed technologies including
CEVA-TeakLite-II™, the new and enhanced version of the widely-adopted
CEVA-TeakLite™ DSP core, a cache memory subsystem, audio peripherals, a
comprehensive set of audio codecs and complete tool chain support.

"The CEVA-Audio solution is based on industry-recognized technology,
with the CEVA-TeakLite-II DSP core having a family heritage of deployment
in more than 500 million units," said Will Strauss, founder and president,
Forward Concepts. "Moreover, CEVA's audio codecs have already been
deployed by leading chip manufacturers for cellular and consumer
electronics devices. CEVA-Audio offers simple integration, designed to
dramatically decrease time to market while the "one-stop-shop" approach
reduces complexity and customers' risk."

CEVA-Audio, a fully synthesizable soft IP, operating at up to 200MHz,
is built on a small DSP core and cache memory subsystem, with overall die
size of less than two square mm, and 0.1 mA/Mhz for stereo MP3 decoder
(using TSMC 0.13u G process). It supports all of the industry standard
audio and speech codecs, including MP3, WMA, AAC, HE-AAC, Ogg Vorbis,

"Today's consumers are demanding more functionality and longer battery
life for less money," said Gideon Wertheizer, CEO of CEVA, Inc. "Built by
CEVA in-house, CEVA-Audio underscores our commitment to provide the
industry with complete platform solutions built around our DSPs, offering
our customers cost, power and time to market benefits."

The CEVA-Audio DSP subsystem includes peripherals, which bridges the
gap between a stand alone DSP and a complete audio platform, and includes
a three-channel DMA to reduce the data transfer overhead. CEVA-Audio is
designed for the low cost, power efficiency and performance required for
portable applications, and includes a power management unit to further
reduce power consumption. The low-cost solution is further achieved by
using a cache memory subsystem. The host interface is a standard AMBA 2.0
interface, including a high-speed master AHB bus for high volume data
traffic and an APB port for host control. The CEVA-Audio is a configurable
IP allowing the user to control the die size and performance. The
configurations include an optional TDM module, optional tightly-coupled
memory and configurable memory size. A complete development tool chain is
provided including a C/C++ compiler, profiler, simulator, debugger and
system boards.

CEVA-Audio is further enhanced by the vast CEVAnet partner program,
whereby partners provide additional audio elements to enhance the
CEVA-Audio-based products. .More information on CEVA and its products can
be found at ceva-dsp.com.

About CEVA, Inc.

Headquartered in San Jose, Calif., CEVA is the leading licensor of digital signal processor (DSP) cores, multimedia, GPS and storage platforms to the semiconductor industry. CEVA licenses a family of programmable DSP cores, associated SoC system platforms and a portfolio of application platforms including multimedia, audio, Voice over Packet (VoP), GPS location, Bluetooth, Serial Attached SCSI and Serial ATA (SATA). In 2005 CEVA's IP was shipped in over 115 million devices. CEVA was created through the merger of the DSP licensing division of DSP Group and Parthus Technologies. For more information, visit ceva-dsp.com.

A PDF copy of this press release is also available here