Customers & Partners

Alif Semiconductor was founded with the vision to address the rapidly growing market need for scalable and secure AI-enabled 32-bit microcontrollers that are genuinely power efficient.

“Partnering with Ceva allows us to leverage their industry-leading audio DSP and Bluetooth IP in our next-generation audio SoC designs that integrate multimedia functionality and wireless connectivity.”

 

"Ambiq Micro is pleased to partner with CEVA and integrate their BLE connectivity solutions into our next generation SPOT-based wireless SoCs"

"AIC Semiconductor Co., Ltd. (AIC), a new China-based fabless company focused on the IoT market has licensed CEVA's RivieraWaves 802.11ax Wi-Fi 6 IP for a low power System-on-Chip (SoC)."

"Through the comprehensive cooperation between CEVA and ASPEED, our customers can enjoy the most superior video & audio functionality and we are glad to have CEVA as our strong and trusted partner."

“Our low power architecture integrates the RW-BLE5 Software and Link Layer IP from CEVA, a perfect complement to our power saving and energy harvesting RF CMOS innovations, to help achieve our vision of a battery-free IoT future.”

Advanced Bionics is a licensee of CEVA DSP technology

“CEVA’s imaging and vision DSP provides the platform which allows us to further enhance the image quality of our solutions and push the boundaries of what a camera can do using artificial intelligence and advanced vision algorithms.”

“The CEVA-XM4 intelligent vision platform provides us with the processing capabilities and the development suite to truly harness the power of AI in our drone SoC designs.”

“As a key IP partner to ASR, CEVA contributes significant value to our products, enabling us to offer best-in-class modem, connectivity, vision and sound specifications for the smartphone and IoT markets.”

"Autotalks and CEVA have enjoyed a long and successful relationship, with their unique expertise in cellular and communication DSPs perfectly complementing our wireless know-how. The CEVA-XC DSP allowed us to quickly and seamlessly implement C-V2X support on our chipset in addition to DSRC, resulting in the world's first and only truly secure global V2X solution."

Beken Corporation (SSE: 603038), founded in 2005 by returnees from famous Silicon Valley IC companies, is the leading domestic IC provider of wireless connectivity chips in IoT, consumer electronics and industrial applications. Headquartered in Zhangjiang, Shanghai.

Founded in 2015, Bestechnic specializes in the development of wireless ultra-low power computing SoCs for the advanced smart audio, smart wearables, wireless connectivity and smart home markets. Our engineering teams are dedicated to R&D work in a wide range of areas, including RF and analog, wireless communication, acoustic and audio signal processing, image and vision signal processing, NPU, ultra-low power computing SoC, as well as complete software stack and complex operating system. As a leading technology and SoC supplier, our products have been adopted by leading brands worldwide.

boAt set its sail back in 2016. Both our founders, Aman Gupta and Sameer Mehta, realized the massive gaps in the audio and wearable market of India and hence founded boAt with the vision of making a lifestyle brand, that enhances the quality of life through audio and wearables. Today, boAt is the world's 2nd largest wearable brand (IDC Q3 2022) along with being India’s No.1 Audio brand. Seven years down the road, boAt has become a crucial part of cultural conversations for the younger generation, lifestyle influencers, audiophiles, and a lot of many segments. boAt has hence become an advocate of self-expression, adventurous experiences, and exploration all the way. Driven by a blazing passion for music and an instinct for innovation, boAt intends to deliver more than just a product to its community. This account is a sneak peek into the feisty world of boAt - its showrunners, hustle, collaborations, #InsideboAt culture, and beyond.

Broadcom is a licensee of CEVA-XC, CEVA-TeakLite-III and CEVA-Teaklite DSPs

Ceragon, the #1 wireless backhaul specialist to deploy CEVA-X and CEVA-XC DSPs in new high performance multicore architecture for its 5G wireless backhaul solutions

Cirrus Logic is a licensee of CEVA DSP technology

“We have chosen CEVA’s RivieraWaves dual mode Bluetooth IP because it allows us to address the widest possible range of applications, covering both classic and low energy connections. We are delighted with the quality and excellent technical support, which enabled us to rapidly integrate Bluetooth capabilities into Espressif’s ESP32 platform.”

“Leveraging CEVA’s Wi-Fi IP for the development of our ECR6600 product allowed us to rapidly develop a fully-featured, robust connectivity IC and target the tremendous opportunity for Wi-Fi 6 chipsets in the consumer and IoT markets.”

FujiFilm is a licensee of CEVA DSP technology

Fujitsu is a CEVA licensee of CEVA DSP technology

“The rapidly expanding IoT market is demanding next generation, highly integrated chip solutions to unleash its full potential. We set ultra-low power connectivity as a key objective for GDM7243i and CEVA’s RivieraWaves Bluetooth IP, with its minimal processor loading architecture, was a great fit for our solution.”

“The CEVA imaging and vision DSP enables us to add leading-edge computer vision-based functions to our SoCs, allowing our customers to create differentiated and sophisticated smart camera products.”

"We are delighted to announce Goodix as a licensee for our Bluetooth low energy IP," said Ange Aznar, Vice President and General Manager of the Wireless IoT Business Unit at CEVA. "Goodix is a household name in the mobile industry we're proud to be their partner for Bluetooth IP as they continue their strategic expansion into broad IoT markets."

“CEVA’s DSP delivers outstanding power efficiency, while maintaining exceptional performance standards”

“Our extensive mixed signal and RF design expertise along with the low power architecture of CEVA’s RW-BLE5 IP and the advanced process technology from UMC has allowed us to deliver a best-in-class product for this burgeoning market.”

Intel is a licensee of CEVA DSP technologies

“The CEVA-XM4 delivers the best performance and power efficiencies in the market and provides the software infrastructures by which product builders can add their own algorithms and introduce revolutionary applications for vision-based systems.”

“CEVA delivers high-performance communications processing, enabling us to address a broad range of global markets and customers with our smart grid and smart city platforms.”

iRobot is a licensee of CEVA technology

“CEVA is widely acknowledged as the industry leader in DSP and platform IP and our long and detailed selection process clearly identified them as an ideal strategic technology partner for our next-generation products”

LG Electronics is a licensee of CEVA DSP technology

“CEVA’s silicon proven Wi-Fi IP helped us immensely to deliver an outstanding solution offering great reliability and power efficiency at low cost in a very small footprint.”

Lingsi Technology is a high-tech enterprise focusing on providing smart terminal system-level (SoC) chips. Its products can be widely used in home appliances, education and office, consumer electronics, smart cars and other fields. Since its establishment, the company has been committed to deeply coupling the world's cutting-edge artificial intelligence algorithms with independent leading chip designs to create extremely cost-effective single-chip solutions and promote the true arrival of the era of intelligent connection of all things.

Mediatek is a licensee of CEVA DSP technology

Microchip is a licensee of CEVA DSP technology

“At MorningCore, we are focused on developing leading-edge wireless silicon platforms to advance the use of the latest wireless technologies in China. The CEVA-XC DSP is the perfect choice for our software-defined radio chip technology platform, allowing us to develop solutions for a wide range of use cases, ranging from cellular V2X and drone communications, to 5G terminals and satellites.” Mr. Liu DiJun, Vice President at MorningCore.

"Nextchip's selection of the CEVA-XM4 is another endorsement of the unique capabilities of our vision IP and its value proposition for the ADAS market. The APACHE4 brings key ADAS features within reach of every car manufacturer and model, moving us closer to a world of enhanced driver safety and, ultimately, safer roads."

"We are pleased to announce our relationship with CEVA to integrate their Bluetooth low energy IP into our BLE5 IC," said Liang Jie, V.P. of Nations. "CEVA's track record in developing the lowest power connectivity IPs is unrivalled and perfectly aligns with our performance requirements for integrating Bluetooth into our security ICs and other IoT chips."

"The CEVA-XC framework is a highly renowned DSP architecture for communications processing and is ideal to meet the stringent performance requirements of next generation 4.9G and 5G base stations,"

“The CEVA-XM4 is an exceptional processor for imaging and computer vision, offering outstanding performance, flexibility and power efficiency for applications requiring visual intelligence capabilities”

"In designing the nRF91 SoC, we were able to leverage CEVA’s expertize in low power DSPs and parallel processing architecture to achieve outstanding power consumption, while retaining the flexibility to support multiple cellular IoT standards.”

"The CEVA-Dragonfly NB2 enabled us to massively accelerate our time-to-market by providing many of the key building blocks for our SoC design, already silicon proven and pre-integrated. In addition, through the programmable nature of the Dragonfly solution, our engineering team were able to add our innovation during the communication system development and SoC customization. This framework eventually helped us to create a truly differentiated product. Our path from licensing to silicon was achieved in under one year, and we're now engaged with operators worldwide to certify our SoC."

“The automotive industry requires cost- and power-efficient vision-based ADAS solutions to address the growing end-customer demand and safety regulations across all tiers of the automotive industry…CEVA’s industry-leading vision processing IP provides us with a comprehensive solution that enables us to integrate a host of innovative and intelligent system features into our ADAS product offerings.”

“We chose CEVA’s RivieraWaves BLE technology as an important component of the Bluetooth connectivity solution of Opn due to its winning combination of market leadership, quality of IP and excellent technical support.”

“Our customers demand the highest quality multimedia experience in a cost-effective, highly integrated platform, with Bluetooth being an essential feature. CEVA’s RW-Bluetooth Dual Mode IP provided us with the latest enhancements valued by our customers, along with the expert technical support valued by our engineers.”

Provider of system-on-chip SoCs designed for third-generation E/E architecture of smart cars. The company offers smart car chips and solutions for automakers, which include chip requirements for smart car end-side smart components, smart regional processors, and integrated computing units, enabling automobile industry users to reduce costs and time to develop new products and features.

NXP^® Semiconductors N.V. (NASDAQ: NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets. Built on more than 60 years of combined experience and expertise, the company has 31,000 employees in more than 33 countries and posted revenue of $9.5 billion in 2016.

Peter Claydon, General Manager at Picocom, commented: “Small cells are set to play a crucial role in the success of 5G networks, by diversifying the supply chain of network equipment, densifying network coverage and improving reliability. Our forthcoming SoC powered by the CEVA-XC12 DSP provides network operators with a highly-powerful, scalable solution to bring 5G coverage anywhere and enable new use cases ranging from industrial automation to neutral host networks.”

Pimchip Technology is a pioneering company of processing-in-memory (PIM) technology bringing a vision that the universe can be better perceived by AI computing. The PIM technology, combining processors and data storage, revolutionizes the computing architecture paradigms by breaking through the inherent limitations of traditional chip architecture (Von Neumann), known as “memory wall” problem, and hence enables high-performance AI computing engines at low cost.

“The underlying processor technologies in satellites have remained mostly unchanged for nearly two decades, resulting in poor performance for today’s processing-intensive applications…Our new RC64 processor based on the CEVA-X1643 DSP promises to change this, bringing outstanding performance, programmability and scalability to next-generation satellite systems, and enabling the massively parallel processing required for many of the latest satellite communications, research and observation applications.”

“CEVA’s Bluetooth baseband and protocol stack IP provides us with a feature-rich, low power architecture which we were easily able to enhance and integrate with our leading-edge RF and transceiver technologies to deliver a highly-competitive single-chip Bluetooth 2.1 + EDR offering…CEVA’s reputation as a world class IP provider is well deserved.”

“The silicon performance of our Bluetooth 2.0+EDR Radio along with the CEVA-Bluetooth IP at the recent UnPlugFest revealed a very competitive combined Bluetooth solution…We are delighted to further co-operate with CEVA in creating this platform and address the strong demand for a complete Bluetooth 2.0+EDR reference design from our customers.”

Rockchip is China’s leading fabless semiconductor company and has been honored with China Chip Awards for 10 times. Since its establishment, Rockchip is committed to providing technical innovation and prompt support to fuel successful growth for our customers.

Rohde & Schwarz is striving for a safer and connected world with its Test & Measurement, Technology Systems and Networks & Cybersecurity Divisions. For over 90 years, the global technology group has pushed technical boundaries with developments in cutting-edge technologies. The company’s leading-edge products and solutions empower industrial, regulatory and government customers to attain technological and digital sovereignty.

“By leveraging CEVA’s DSP technology in our LTE modem design, we ensure ultra-low power consumption, critical to the successful adoption of LTE in these battery-powered devices”

"The CEVA-XC DSP delivers outstanding performance and flexibility required to power our multi-standard broadband satellite SoC,"

Yoel Gat, CEO of SatixFy.

Shanghai Frequen (Freqchip) is located in Shanghai, China Zhangjiang Hi-Tech Park. Our company is focused on the analog, RF and low-power wireless connection technology at the core of integrated circuits for consumer electronic products. We are a customer-orientated company with a rich experience in research and development, mass production and rapid response to market needs. Our first generation Bluetooth audio SoC family, FR301x is widely adopted in Bluetooth earphones and wireless music boxes. Now Freqchip is releasing our true BLE SoC, the FR801x series based on CEVA's RivieraWaves platform. This will be widely used in wearable devices, smart controllers, smart medical detectors, secure payment equipment and other low power IoT devices. Next, Freqchip will release our new dual mode Bluetooth SoC, also based on CEVA's RivieraWaves Bluetooth IP. A highly professional organization, Freqchip always strives to be the leading provider of wireless and audio relevant applications.

"CEVA's PentaG modem IP provides us with a powerful DSP along with a comprehensive set of hardware and software technologies that shorten the design cycle for our upcoming 5G platform and ensure we deliver the industry-leading performance and efficiencies which our customers demand." Bertrand Debray, EVP and GM, Broadband IoT, Sequans.

“Following a detailed selection process, the CEVA-TeakLite-4 DSP proved to be the lowest-power choice for high-performance audio processing required for next-generation application processors…The low power capabilities combined with CEVA’s comprehensive audio software offerings and excellent technical support provides us with a complete, end-to-end audio solution for our next-generation application processors.”

Sharp Semiconductor Innovation Corporation (SSIC) is developing IoT SoC design technology that can be applied to various applications, accommodating future specification changes in the B5G era.

"Enabling future-proof, technology-leading processor designs is a key step in SiFive's mission to unlock technology roadmaps," said Dr. Naveed Sherwani, president and CEO, SiFive. "The rapid evolution of AI models combined with the requirements for low power, low latency, and high-performance demand a flexible and scalable approach to IP and SoC design that our joint CEVA / SiFive portfolio is superbly positioned to provide. The result is shorter time-to-market, while lowering the entry barriers for device manufacturers to create powerful, differentiated products."

"CEVA's computer vision and neural network platform is key to our SoC, allowing us and our customers to simply and efficiently deploy high-performance computer vision algorithms and neural networks on the edge device, without requiring a connection to the cloud."

Semiconductor Manufacturing International Corporation (“SMIC”; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China. SMIC provides integrated circuit (IC) foundry and technology services at 0.35-micron to 40-nanometer and has begun offering advanced 28nm process technology. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm mega-fab in Shanghai, a 300mm mega-fab in Beijing, a 200mm fab inTianjin, and a 200mm fab project under development in Shenzhen. SMIC also has customer service and marketing offices in the U.S.,Europe, Japan, and Taiwan, and a representative office in Hong Kong.

Socionext Inc., a leading provider of SoC-based imaging solutions, has licensed and deployed the CEVA imaging and vision DSP to power its latest-generation Milbeaut® image processing LSI chips targeting surveillance, digital SLR, drones, action and other camera-enabled devices.


The inclusion of the CEVA imaging and vision DSP in Socionext's Milbeaut series of image processors allows customers to achieve true product differentiation by implementing proprietary technologies and applications that can take advantage of its powerful vector processing engine. The DSP offers outstanding performance, flexibility and power efficiency for implementing such advanced algorithms, making it the ideal choice for next-generation imaging processing products.

“The ability to encode and decode video and audio on a single DSP engine supporting multiple multimedia codec standards in software enables our MagusCore™ processor platform to reduce design costs while addressing a wide range of end markets”

“Our latest generation SWORD™ chip reinforces our mission to continually introduce new and innovative technologies that greatly improve the user experience of hearing aids. The integration of CEVA’s advanced Bluetooth Dual Mode IP into our wireless chip enables us to bring low power stereo audio streaming and data connectivity to our hearing aids, giving our customers an unparalleled user experience,”

Sony is a licensee of CEVA DSP technology

“Robust and dependable signal processing IP blocks are a critical component of our next-generation products…CEVA’s product offerings meet the most stringent performance and reliability metrics we require, in addition to providing outstanding technical support for their IP.”

“The very small footprint and high performance of the CEVA-TeakLite® DSP made it the optimum choice for DSL applications where lowest-cost per channel is key”

“Ceva’s MM2000 solution provides the range of functionality support we need for our new line of PMP ICs, and does so with power efficiency required for all types of portable consumer products such as MP3 players, cell phones and gaming devices”

 

Texas Instruments is a licensee of CEVA DSP technology

Toshiba is a licensee of the CEVA-TeakLite-III DSP and CEVA SATA technology.

"Ceva is an ideal company to work with THX to take spatial audio solutions to the next level given its synergistic voice, audio and sensor fusion solutions and embedded systems expertise. I look forward to working with CEVA to create further enhanced entertainment experiences for our customers."

 

Unisoc is a licensee of CEVA DSP and Bluetooth technologies

“The CEVA-X DSP delivers the optimal balance of performance and programmability while lowering the overall cost of deployment for our LTE processors. This unique combination enables us to efficiently address mass market LTE chipset requirements targeting China and beyond”

"Licensing their RivieraWaves BLE5 and Wi-Fi 6 IPs enables us to accelerate the development of our next generation of IoT SoCs and MCUs and meet the incredible demand for IoT connectivity chips across the IoT landscape."

WUQI Microelectronics is a leading semiconductor fabless company focused on connectivity and edge AI chips. Our products include SoCs for Wi-Fi, Bluetooth Audio, edge AI, and PLC (Power Line Communication). With leading technology in Mixed Signal IC design – including RF, Low power, and RISC-V CPU – and a comprehensive solution of software SDKs and algorithms, WUQI’s products have been adopted by world-class clients such as TP-Link, OPPO, JBL, Anker, JLab, Geely Auto, Xiaomi, and more.

“Our comprehensive selection process has led us to understand clearly that the CEVA-TeakLite-4 cores have the industry-leading audio/voice DSP architecture, the smallest footprint, and the best power efficiency for mobile product ICs. We continue to work together with CEVA for the continual advancement of our audio/voice product roadmap, integrating leading-edge technologies, yet achieving better performance and greater power efficiency at the same time.”

“With its capability to support multiple air interface standards including LTE and 3G in one platform, the flexible CEVA-XC DSP is an outstanding processor architecture to serve the future needs of cellular base station SoCs”