Join our team at Embedded World 2024, April 9-11 in Nuremberg, Germany, to learn how our Wireless Communication and Edge AI Sensing IPs help to accelerate your next-generation Smart Edge chip design.

We will be showcasing a broad range of our technologies in Ceva’s booth, with demonstrations of our best-in-class silicon and software IP solutions and Ceva-powered devices on display, including:

• Wireless IoT connectivity – platform solutions combining next-gen Bluetooth including Channel Sounding, Auracast broadcast audio and ESL, 802.15.4 for Zigbee, Thread, and Matter, Wi-Fi 6/6E/7, and UWB for automotive, industrial, and consumer applications
• 5G communications – platform solutions for RedCap, massive IoT, satellite communication and Open RAN
• Classic and Generative AI – NPU and DSP solutions for power-efficient vision, radar, and audio applications, from TinyML up to 1200 TOPS of AI inferencing
• Immersive audio – spatial audio with head tracking and AI-powered call clarity for noise-free conversations and immersive experiences in aural devices

• Sensor fusion technologies – motion control for robotics, wearables, handheld controllers, PC, and smart TVs

Visit us at booth 4-462. 

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