Description
About the Business Unit:
Ceva is at the forefront of the Smart Edge revolution, with innovative state-of-the-art Silicon and Software solutions that enable products to Connect, Sense and Infer. Our advanced wireless technologies, including Bluetooth, Wi-Fi, UWB, and Cellular IoT, are integrated into over a Billion devices annually. We are offering you a unique opportunity to shape and make a great impact on the roadmap of connected devices.
About the role:
In this role, you will be at the intersection of cutting-edge wireless technology and direct customer engagement. As a Wireless Architect, you drive the definition of connectivity subsystem architectures for next-generation products including Wi-Fi, Bluetooth, and UWB with mixed analog/digital hardware. You will also serve as a key technical partner for our customers, leading technical pre-sales, co-develop joint solution offerings, and bring a creative, flexible mindset to solving complex real-world connectivity challenges. This requires both architectural depth and strong product engineering experience, from concept through productization.
Responsibilities:
Drive full-system view of how the connectivity subsystem interacts within an SoC, including CPU/processor, memory, and peripheral interfaces
Definition of connectivity subsystem architecture specifications including :
- Feature-set definition and PPA (Power, Performance, Area) targets
- Definition of system low power modes and PMU requirements
- Definition of HW and SW interfaces of the connectivity sub-systems including: HW interfaces, state machines, operation sequences etc…
- Analog and digital domains partitioning
Customer facing and technical engagement
- Lead technical discussions with customers, presenting connectivity architecture options and value propositions
- Co-develop joint solution offerings with customers and partners, acting as technical advisor during system integration phases
Support product lifecycle and productization
- Support post-tape-out testing, production validation, and productization of wireless connectivity solutions
- Lead or contribute to production-readiness activities including silicon characterization, yield analysis, and qualification testing
Cross-functional leadership
- Work closely with logic design, physical design, firmware, and validation teams to ensure successful implementation
- Support wireless subsystem integration process from architectural definition through implementation, lab integration and test coverage planning
- Collaborate with product management and business development stakeholders to translate customer feedback into architectural requirements and product roadmap inputs
Requirements
Requirements:
- B.Sc. or M.Sc in Electrical Engineering
- Deep understanding of full-system SoC architecture, with emphasis on how connectivity subsystems interact with processors, memory controllers, power domains, and software stacks
- Product engineering experience: deep understanding of full lifecycle including post tape-out testing, silicon bring-up, productization, and production qualification.
- Experience in system definition for wireless communication systems
- Experience in wireless communication standards (such as WiFi/BT/Cellular/UWB)
- Experience in ASIC design and architecture, with proven experience in successful tape-outs and production
- Knowledge in performance and power modeling and analysis
- Deep understanding of VLSI development process and methods
- Technical leadership
- Strong communicator, able to translate complex architectural concepts for customers, executives, and engineering teams.
- Creative and flexible mindset: comfortable navigating ambiguous requirements and proposing pragmatic, innovative solutions
- Proven customer facing experience. Leading technical discussion, building trust, and influencing design decisions.
Advantages:
- Knowledge in RF integration and performance optimization
- Previous experience with 3rd party IP integration
- Knowledge in CPU/Processor architecture