Meet CEVA’s New Smart & Connected Development Platform

Today CEVA announced its new DSP-based IoT development platform – enabling developers prototype their IoT designs where the device needs to be both smart AND connected. The new platform combines a host of sensing, processing and connectivity technologies that mobile, wearable and smarthome SoC designs require.

CEVA TeakLite-4 development board walk through

Addressing this smart AND connected challenge when designing an IoT device is one of the hottest areas of the semiconductor industry these days. While an IoT device must be connected, it is not always smart. Standards like Wi-Fi, Bluetooth and ZigBee ensure that 10s of billions of devices will be connected to each other and the internet over the next decade. But where does the intelligence required to make these devices ‘smart’ come from and how is it enabled?

How Will The Smart Home of The Future Look Like?

Think about a smart home of the future: Your control of it will not require a smartphone or tablet app with a nice interface and a plethora of commands. Instead, your voice will be the primary means of control and allow you to perform hundreds of functions within the home, either when you are present or even remotely. And your smart home will know if it’s you or your partner who is addressing it by verifying your voice pattern. It will also be able to tell if it hears an unusual noise, such as a breaking glass and be able to react to that by alerting a security company to check the situation.

The smart home controller will also integrate vision capabilities to recognize faces and identify who is entering the house. With that information, it will be able to set preferences around the home based on your profile such as set the lighting to the levels you like, drawing curtains or alert you of any messages that may have been left for you. In addition to voice, the smart home controller will contain motion sensors that detect movement in the house and be able to learn your habits. For example, turn on underfloor heating in your bathroom if it knows you are getting ready for bed based on your routine

Jump Start Your Smart IoT Designs with CEVA’s New IoT Development Platform

These are just a few of literally thousands of potential applications that will be part of the smart home of the future – and the one thing that they all have in common is that these technologies and applications require a DSP to enable them. To address this, our new IoT development platform is built around a 500MHz CEVA-TeakLite-4 DSP + subsystem in silicon. This is the ‘brains’ of the platform. Also included is a CPU and system interfaces, Arduino shield expansion, Linux OS on the CPU and RTOS on the DSP, plus hundreds of optimized software packages for audio, voice and sensing applications from CEVA and partners. In fact, there is not nearly enough room here to list everything contained within the platform

CEVA’s ‘Smart & Connected’ Development Platform, featuring the CEVA-TeakLite-4 DSP development chip (silicon) running alongside an FPGA with ARM Cortex-A9 twin cores and a full range of system peripherals and interfaces for DSP enhanced IoT designs

Want to Hear More?

Register to upcoming live webinar: “Fast Track to Smarter IoT” being held on November 19^th and learn on the new platform to jump start your smart IoT designs.

And if you want to know even more, drop us a quick email and we’ll be happy to help.

#Bluetooth #CEVA-TeakLite-4 #DSP #IoT #SoC #Wi-Fi #ZigBee

Posted By

Moshe Sheier

Moshe Sheier serves as our Vice President of Marketing. Mr. Sheier brings with him more than 20 years of experience in the semiconductor IP and chip industry in both development and managerial roles. Prior to this position, Mr. Sheier was the Director of Product Marketing at CEVA and before that he has managed Xilinx Inc. partner program in EMEA. Before joining CEVA, he was with the DSP Group since 1993, holding different engineering and R&D management positions, including the VLSI Department Manager. Mr. Sheier holds several US patents in the area of DSP architectures, a B.Sc. in Electrical Engineering and an M.B.A.