The Future is Intelligent. Let’s Build it Together.
Join Ceva Edge Symposium to see how breakthroughs in connectivity, sensing, and AI inference are turning edge devices into autonomous, context-aware systems, the building blocks of Physical AI and Agentic AI.
Join industry leaders, engineers, innovators, and Ceva experts defining the future of intelligent edge computing.
Register today and secure your place!
Agenda
| 09:30-10:00 | Registration opens | |
| 10:00-10:10 | Welcome by Bruce Wang, China GM and VP Sales, Ceva | |
| 10:10-10:40 | Market Perspective: Guest Speaker Mr. Li Ke CCID Consulting Co., Ltd, | |
| 10:40-11:30 | Panel Discussion: Intelligence in Action: Shaping the Future of Smart Edge Devices, Richard Kingston, VP Market Intelligence, IR & PR, Ceva (Host) Iri Trashanski, Chief Strategy Officer, Ceva Yaron Galitzky, EVP AI Division, Ceva Ziv Hammer, EVP Connectivity & Sensing Division, Ceva |
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| 11:30-11:50 | Tea & Coffee Break | |
| 11:50-12:20 | Customer Success Story: Dr. Zhou Zhengyu Chairman/CEO of Action Actions, a leading fabless semiconductor company specializing in low-power AIoT SoCs, will discuss the next generation of intelligent edge devices. |
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| 12:20-12:50 | Architecting for What’s Next: Turning Innovation into Differentiation How flexible IP platforms and software ecosystems enable faster innovation, greater product differentiation, and optimized performance for evolving market needs Ran Livne, Senior Director of Architecture, Ceva |
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| 13:00-14:00 | Lunch Break | |
| AI & Sensing track | Wireless track | |
| 14:00 – 14:30 | The Physical AI Era: Where the AI Market is Heading Next AI application trends shaping the next generation of intelligent edge devices Amihai Kidron, Senior Director of AI Product, Ceva |
Bluetooth 7, Radio Subsystems and Beyond Higher Throughput, Higher Bands, New Possibilities, and faster SoC design with Links Radio-Subsystems Franz Dugand, Product Marketing Senior Director, Ceva Elad Baram, Director of Product Marketing, Ceva |
| 14:30-15:00 | Breaking the Memory Wall: Scaling LLM Inference from Edge to Cloud Addressing the memory, bandwidth, and efficiency challenges of GenAI deployment Amihai Kidron, Senior Director of AI Product, Ceva |
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| 15:00-15:30 | Future-Proof NPU Design for the LLM Era Architectural innovations for efficient LLM, multimodal, and next-generation AI workloads Ran Livne, Senior Director of Architecture, Ceva |
Wi-Fi’s Next Evolution From Multi-Link Operation to Ultra-High Reliability – How Wi-Fi 7 and Wi-Fi 8 Enable Superior Connectivity for IoT and Premium Devices Franz Dugand, Product Marketing Senior Director, Ceva Guest speaker: Yi Yang, CEO, ACTT Guest speaker: Thomas Wu, CEO, Sirius Wireless |
| 15:30-16:00 | Small Models, Massive Scale: Capturing the Sub-1 TOPS AI Opportunity Unlocking high-volume AI opportunities in power- and cost-constrained edge devices Amihai Kidron, Senior Director of AI Product, Ceva |
IEEE 802.15.4ab: From UWB Proximity Awareness to Infrastructure-Scale Spatial Intelligence Franz Dugand, Senior Director of Product Marketing, Ceva Guest speaker: Markus Pettersson, Head of Laboratory, LG Electronics |
| 16:00-16:20 | Tea & Coffee Break | |
| 16:20-16:50 | AI in Action: Partner Solution Showcase Real-world AI products and solutions powered by Ceva technologies and ecosystem partners Guest speaker: Xiao Chen, Bdsound |
Building the Next Generation of 5G NTN & Autonomous Networks Custom silicon as a key enabler and differentiator for satellite and drones communications Elad Baram, Director of Product Marketing, Ceva |
| 16:50-17:20 | IMU: The Workhorse of Sensors – from robots to earbuds Stephen Scheirey, Head of Sensors & Audio Product Line, Ceva |
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| 17:20-17:30 | Customer Awards Ceremony and Lucky Draw | |
Venue
Zhangjiang Hilton Hotel
1398 Haike Rd, Kangqiaozhen
Pudong, 201203 Shanghai